Cliff Hou, Senior Vice President of Europe and Asia Sales at TSMC. “This collaboration between MediaTek and TSMC on MediaTek’s Dimensity SoC means the power of industry’s most advanced semiconductor process technology can be as accessible as the smartphone in your pocket,” said Dr. “TSMC's consistent and high-quality manufacturing capabilities enable MediaTek to fully demonstrate its superior design in flagship chipsets, offering the highest performance and quality solutions to our global customers and enhancing the user experience in the flagship market.” “We are committed to our vision of using the world’s most advanced technology to create cutting edge products that improve our lives in meaningful ways,” said Joe Chen, President of MediaTek.
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This marks a significant milestone in the long-standing strategic partnership between MediaTek and TSMC, with both companies taking full advantage of their strengths in chip design and manufacturing to jointly create flagship SoCs with high performance and low power features, empowering global end devices. HSINCHU, Taiwan – Septem– MediaTekand TSMC (TWSE: 2330, NYSE: TSM) today announced that MediaTek has successfully developed its first chip using TSMC’s leading-edge 3nm technology, taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production expected next year. Climate Risk and Opportunity Management.Thomas, High Performance Technology Intern.Wen-Wei, Wireless Communications Department Intern.Raahgini Chandrasegaran, Innovation Center Singapore.
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李先驰, Wireless Communications Technology Intern.Han-bin, Wireless Communications Intern.
Gan Tang, Wireless Communications Intern.Financial Statements for the Past 5 Years Condensed Statements of Comprehensive Income / Statements of Income
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